ADLINK CRR-LX800-E-500 Compact Industrial Computer Module (COM)
ADLINK CRR-LX800-E-500 is a compact, industrial-grade Computer-on-Module (COM) built on the low-power AMD Geode™ LX 800 processor operating at 500 MHz. Designed to the ETX specification standards, this embedded board delivers reliable x86 computing performance with minimal power consumption, making it ideal for fanless, legacy industrial automation, transportation, and medical control applications.
Technical Parameter List
| Category | Specification Details |
| Processor | AMD Geode™ LX 800 (500 MHz, 128KB L2 Cache) |
| Chipset | AMD CS5536 Companion Device |
| System Memory | Onboard DDR SDRAM (up to 512 MB, model dependent) |
| Form Factor | ETX (Embedded Technology eXtended) Module |
| Display Support | Integrated AMD Geode graphics engine (VGA & 18/24-bit LVDS/TTL) |
| Network | 10/100 Mbps Fast Ethernet controller |
| Storage Interfaces | 2x Ultra DMA 66/100 IDE channels |
| Expansion Bus | PCI Bus (4x masters), ISA Bus (via PCI-to-ISA bridge) |
| I/O Interfaces | 4x USB 2.0, 2x COM ports (RS-232), LPT Parallel, PS/2 Mouse/Keyboard |
| Audio | AC’97 Line-In / Line-Out / Mic-In interface |
| Power Input | Single +5V DC input (Standby +5VSB optional) |
| Power Consumption | Approx. 5W to 7W typical (Fanless operation) |
Product Features & Core Advantages
Ultra-Low Power Architecture: Powered by the AMD Geode LX800 processor, enabling high reliability and completely fanless operation in sealed or dust-sensitive enclosures.
Legacy Compatibility: Features native support for PCI and legacy ISA expansion buses, facilitating seamless drop-in replacements and extended lifecycles for industrial hardware setups.
Compact ETX Form Factor: Standardized board footprint with dual 100-pin Hirose connectors ensures direct integration with custom carrier baseboards.
Broad Display Options: Supports dual independent display output combinations including analog VGA CRT and flat-panel LCD displays via LVDS or TTL interfaces.
High Reliability & MTBF: Industrial-grade components ensure continuous 24/7 continuous operation in harsh industrial environments.
Model Classification
CRR-LX800-E-500: Standard production module featuring AMD Geode LX 800 processor (500 MHz) with commercial temperature range support ($0^\circ\text{C}$ to $60^\circ\text{C}$).
CRR-LX800-E-500-ET: Extended temperature variant engineered for extreme thermal operational conditions ($-40^\circ\text{C}$ to $+85^\circ\text{C}$).
CRR-LX800 Baseboard / Evaluation Kit: Carrier board system designed for hardware design verification, firmware development, and rapid prototyping.
Environmental Tolerance Conditions
| Environmental Factor | Operating Specification | Storage Specification |
| Temperature Range |
$0^\circ\text{C}$ to $60^\circ\text{C}$ (Standard) $-40^\circ\text{C}$ to $+85^\circ\text{C}$ (Extended Temp) |
$-40^\circ\text{C}$ to $+85^\circ\text{C}$ |
| Relative Humidity | 10% to 90% non-condensing | 5% to 95% non-condensing |
| Vibration Tolerance | 5G rms, 5–500 Hz (Random) | 5G rms, 5–500 Hz |
| Shock Tolerance | 15G peak acceleration (11 ms duration) | 50G peak acceleration |
Installation Method
Electrostatic Discharge (ESD) Protection: Wear an ESD wrist strap connected to a grounded surfaces prior to handling the module.
Carrier Board Alignment: Carefully align the four 100-pin Hirose connectors on the underside of the CRR-LX800-E-500 module with the corresponding mating connectors on the carrier baseboard.
Mating Process: Press firmly and evenly on all four corners of the module until it snaps securely into place on the carrier board.
Thermal Solution Mounting: Secure the heat spreader or passive heatsink onto the CPU/chipset assembly using the specified standoff mounting screws to ensure proper thermal dissipation.
Fastening: Secure the module using M2.5 screws through the board standoffs to prevent physical detachment under vibration.
Operating Instructions
Power Supply Requirement: Ensure the carrier board supplies a regulated $+5\text{V DC}$ primary power line ($\pm 5\%$ tolerance).
BIOS & Boot Setup: Access the AMI BIOS utility during system startup (press DEL or F2 during POST) to configure boot sequences (IDE drive, USB boot, or PXE network boot) and I/O resource allocations.
OS Deployment: Install x86-compatible operating systems such as Windows Embedded Standard, Windows XP/CE, Linux kernel 2.6+, or real-time OS (RTOS) platforms. Ensure AMD CS5536 graphics and audio drivers are pre-loaded into the OS image.
Maintenance: Periodically inspect thermal paste/pads beneath the heat spreader to maintain proper heat dissipation efficiency over extended deployments