SAMSUNG SMBK-12 IOU Rack Backplane
SAMSUNG SMBK-12 IOU Rack Backplane
The SAMSUNG SMBK-12 is a 12-slot Input/Output Unit (IOU) expansion rack backplane designed as the central structural and electrical backbone for high-density Samsung SPC and SM-series PLC automation architectures. It integrates power, CPU, and up to 12 dedicated expansion slots for analog, digital, positioning, and specialized communication modules on a single high-durability printed circuit frame. Built with low-latency parallel backplane traces, the SMBK-12 ensures instantaneous data synchronization, minimal signal noise, and stable high-speed parallel bus communication across complex industrial systems.
Technical Parameter List
| Parameter | Specification |
| Model | SAMSUNG SMBK-12 |
| Total Module Capacity | 12 Expansion I/O Slots + 1 Power Supply Slot + 1 CPU Slot |
| Bus Architecture | Parallel high-speed backplane data bus |
| Compatible Series | Samsung SPC / SM-Series PLC System |
| Slot Connector Type | Industrial-grade gold-plated edge connectors with alignment keys |
| Grounding System | Integrated continuous ground plane connected to Frame Ground (FG) |
| Cooling Clearance | Minimum 50 mm clearance top and bottom for convection air flow |
| Mounting Type | Direct panel/wall mounting via M4 heavy-duty chassis screws |
Product Features / Core Advantages
High-Density 12-Slot Expansion: Accommodates large-scale automation projects with up to 12 expansion modules on a single rack, significantly reducing system footprint and panel wiring.
Low-Latency Parallel Backplane Bus: Precision-etched bus traces ensure reliable, high-speed signal transmission and zero-lag communication between the CPU and field I/O cards.
Vibration-Resistant Rigid Chassis: Constructed with an anti-warping aluminum support frame designed to withstand heavy mechanical shock and industrial vibration without contact degradation.
Mechanical Slot Keying: Dedicated slot keying prevents misaligned module insertion, protecting backplane pins and sensitive ICs from short circuits or reverse-mounting damage.
Integrated EMI/RFI Shielding: Multi-layer grounding planes suppress electromagnetic and radio frequency noise to ensure clean signal paths across high-density I/O points.
Model Classification & Series Compatibility
| Model | Slot Capacity | Target Configuration |
| SMBK-04 | 4-Slot Backplane | Compact machines requiring 1 CPU and up to 4 I/O cards |
| SMBK-08 | 8-Slot Backplane | Standard industrial automation panels (8 I/O slots) |
| SMBK-12 | 12-Slot Backplane | Large-scale, high-density I/O control systems (12 I/O slots) |
| SMPS-08 | Power Supply | Compatible 40W rack power module for SMBK backplanes |
| SMCU-CPU | Controller Unit | Main CPU module designed to mount in Slot 0 |
Environmental Tolerance Conditions
Operating Temperature: 0°C to +55°C (32°F to 131°F)
Storage Temperature: -25°C to +70°C (-13°F to 158°F)
Relative Humidity: 5% to 95% RH (non-condensing)
Vibration Resistance: IEC 60068-2-6 compliant (10–57 Hz @ 0.075 mm amplitude, 57–150 Hz @ 1g)
Shock Immunity: IEC 60068-2-27 compliant (15g peak acceleration, 11 ms duration)
Noise Immunity: IEC 61000-4-4 (FTB) 2kV power lines / 1kV signal lines
Installation Method
Panel Preparation: Mark and drill four M4 mounting holes on the control panel mounting plate matching the SMBK-12 backplane dimensions.
Rack Mounting: Secure the backplane frame tightly to the metal panel using M4 screws with spring washers to ensure solid electrical grounding to the panel chassis.
Ground Braid Connection: Run a heavy-gauge copper grounding wire (minimum 2.0 mm²) from the SMBK-12 FG (Frame Ground) terminal directly to the enclosure’s main ground bar.
Power & CPU Insertion: Install the power supply module into the leftmost power slot first, followed by the CPU into Slot 0. before populating remaining I/O slots (Slots 1–12).
Operating Instructions
Module Seating: Push each expansion module straight into its designated slot along the guide rails until the backplane connector locks firmly, then tighten top/bottom retaining screws.
Hot-Swapping Warning: Never insert or remove modules while the power supply module is energized to avoid electrical arc damage to backplane pin contacts.
Slot Mapping: Ensure module slot positions match the hardware configuration specified in the Samsung PLC programming software (WinGPC) I/O table.
Maintenance Checks: Regularly inspect edge connectors for dust accumulation and re-verify mounting screw tightness in high-vibration applications.