AMAT 0190-35310 0100-35175 PCA, Viking Interconnect Board Viking Valve Manifold Assembly
AMAT 0100-35175 and 0190-35310. represent a critical pairing in Applied Materials’ fluid and gas delivery systems.
The 0100-35175 is the Interconnect PCB (Printed Circuit Board), while the 0190-35310 refers to the Viking Manifold Valve Assembly that integrates with it.
Together, they form the “smart” manifold system used primarily in CMP (Chemical Mechanical Polishing) and Wet Clean semiconductor tools.
Technical Parameter Table
| Parameter | AMAT 0100-35175 (PCB) | AMAT 0190-35310 (Valve/Manifold) |
| Description | PCA, Viking Interconnect Board | Viking Valve Manifold Assembly |
| Function | Signal Routing & Solenoid Control | Fluid/Slurry Flow Control |
| Material | Industrial Grade FR-4 | High-Purity PFA / PTFE Wetted Parts |
| Voltage | 24V DC Logic | Pneumatic Actuation (Air-to-Open) |
| Interface | Multi-pin Ribbon Header | 1/4″ or 3/8″ Flaretek/Pillar Fittings |
| Compatibility | Reflexion, Mirra Mesa Platforms | Slurry and Chemical Delivery Modules |
Related Models
These components are part of the “Viking” family of fluid management hardware:
0190-72235: Individual Viking Diaphragm Valve.
0100-35048: High-current Motor/Valve Interface.
0190-35324: Alternative Manifold Block configuration.
0010-75122: Complete Fluid Delivery Module (FDM).
Application Cases
This hardware set is essential for the “Wet-End” of semiconductor manufacturing:
CMP Slurry Delivery: Managing the precise timing of abrasive slurry flow to the polishing platen on Reflexion LK tools.
Chemical Blending: Controlling the mixing ratios of acids, bases, and DI water in the cleaner modules of Mirra Mesa systems.
Point-of-Use (POU) Filtration: Integrating with filtration units to monitor and control the flow of ultrapure chemicals.
Product Advantages and Features
Integrated Design: The 0100-35175 PCB mounts directly to the manifold, eliminating complex wiring harnesses and reducing signal noise.
Ultra-High Purity: The 0190-35310 manifold utilizes PFA (Perfluoroalkoxy) wetted parts to prevent metal-ion contamination and resist aggressive chemistries.
Rapid Response: Pneumatic actuation coupled with localized electronic control allows for millisecond-accurate valve cycling.
Modular Serviceability: Individual valves can be replaced on the manifold without needing to discard the entire interconnect board, lowering MTTR (Mean Time To Repair).
Other Models in the Same Series
| SES | 2422 |
| SEW | 31C005-503-4-00 |
| SEW | 31C015-503-4-00 |
| SEW | 31C075-503-4-00 |
| SEW | 31C450-503-4-00 |
| SEW | DFP |
| SEW | DFP 21A |
| SEW | DIP |
| SEW | EF-014-503 |
| SEW | MDF60A-0022-5A3-4-00 |
| SEW | MDF60A-0022-5A3-4-00(MDX60A0075-5A3-4-00) |
| SEW | MDF60A-0075-5A3-4-00 |
| SEW | MDV |
| SEW | MDV60A0075-5A3-4-0T |
| SEW | MHD093C-058-PG0-AN |
Viking II & Viking III: Successive generations of this valve architecture offering improved diaphragm life and reduced dead-space for slurry applications.
0100-35xxx Series: A broad category of interconnect and distribution boards designed for 300mm “Bridge” and native 300mm platforms.
Installation and Maintenance
Installation: When mounting the 0100-35175 PCB to the 0190-35310 manifold, ensure the solenoid connectors are perfectly aligned. Over-tightening mounting screws can stress the PCB traces.
Torque Specs: Use a calibrated torque wrench for the fluid fittings on the manifold to prevent “cold flow” deformation of the PFA material.
Maintenance: Periodically check for “salt” buildup (dried slurry) around the valve stems. In CMP applications, a weekly DI water flush is recommended to prevent particles from scarring the valve seats.
Troubleshooting: If a specific valve fails to open, use the diagnostic LEDs on the 0100-35175 to determine if the 24V trigger signal is reaching the manifold.
Unique Product Description
The AMAT 0100-35175 and 0190-35310 combination represents the intersection of electronic logic and high-purity fluid dynamics.
While the PCB acts as the “nerve center,” the Viking manifold serves as the “valve heart” of the CMP process. For fab engineers maintaining high-yield polishing operations,
this integrated assembly is the key to ensuring uniform material removal and preventing the contamination of sensitive sub-10nm wafer layers.