Watlow

Watlow MLS332 32-Loop Processor Base Unit,Discontinued

Watlow Anafaze MLS332 is the high-capacity, legacy flagship of the MLS300 modular multi-loop series.

Designed to manage complex industrial thermal systems, it offers a dense control architecture that allows users to regulate dozens of independent loops from a single processing unit.

1. Introduction

The MLS332 32-Loop Processor Base Unit is the central “CPU” of the MLS300 ecosystem, specifically configured for systems requiring up to 32 independent PID loops.

This unit operates as part of a modular “stack,” processing data from Analog Input Modules (AIM) and managing outputs through various terminal boards or relay interface boards.

Though now discontinued, it remains a critical component in legacy semiconductor tools, plastic extrusion lines, and large-scale curing ovens.

2. Technical Parameter Table

Feature Specification
Control Loops 32 Loops (Heat, Cool, or Heat/Cool)
Input Channels Supports 32 Differential Inputs (requires expansion AIMs)
Processor Voltage 10 to 28 VDC
Current Consumption < 1.0 Amp at 24VDC
Update Rate ~10Hz aggregate (varies by loop configuration)
Operating Temp 0°C to 50°C (32°F to 122°F)
Communication Modbus RTU / EIA-232 & EIA-485 (via CIM)
Analog Accuracy $\pm 0.1\%$ of Span
Dimensions Approx. 1.89″ x 3.78″ x 6.75″ (Modular block)

3. Product Advantages and Features

Extreme Loop Density: Controls 32 loops in a modular footprint that would otherwise require an entire cabinet of single-loop controllers.

Synchronized Control: Since all 32 loops are processed by a single CPU, ramp/soak profiles across multiple zones can be perfectly synchronized.

Shared Communications: Reduces integration complexity by allowing a single Modbus node to report data for all 32 loops.

Legacy Reliability: Known for an exceptionally long service life in harsh industrial environments with high EMI.

4. Application Cases

Semiconductor Wafer Tracks: Precise management of heating plates across large-scale wafer processing systems.

Complex Plastic Extrusion: Coordinating the die, barrel zones, and adapter temperatures on high-output machines.

Multi-Zone Industrial Ovens: Managing long-tunnel ovens for food production or composite curing.

Environmental Chambers: Simultaneous control of temperature, humidity, and pressure loops.

5. Other Models in the Same Series

As a modular system, the MLS332 typically operates alongside these units:

MLS316: The 16-loop version of the same processor.

MLS300-AIM: Analog Input Module (required to interface sensors).

MLS300-CIM: Control Interface Module (required for communication).

MLS300-OIT: Remote Operator Interface Terminal (Display and Keypad).

MLS300-PM: General designation for the Processor Module.

MLS332

6. Installation and Maintenance

Installation

Mounting: Snap onto a 35mm DIN rail. Ensure the processor is physically connected to the AIM and CIM modules via the appropriate ribbon cables.

Addressing: Use the onboard DIP switches to set the Modbus address (1-247) before powering the system.

Shielding: High-density wiring for 32 loops creates significant potential for noise; ensure all sensor cables are shielded and grounded at the controller end only.

Maintenance

Battery Replacement: The MLS332 uses a lithium battery to retain “Job” memory. If the battery voltage drops below 2.5V, recipes may be lost during power cycles.

Ribbon Cable Check: In high-vibration environments, the ribbon cables between modules can loosen. Periodically inspect and re-seat connections.

Replacement Strategy: Since the unit is discontinued, consider keeping a “Working Surplus” unit on hand or planning a migration to the Watlow EZ-ZONE® RM system.

7. Unique Product Description

“The Watlow MLS332 is the heavyweight champion of legacy multi-loop control.

It packs 32 loops of professional-grade PID intelligence into a modular chassis, turning a complex web of thermal zones into a single, cohesive, and easily managed system.

It is the definitive solution for engineers who need massive control capacity without the massive footprint.”

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