LAM VME split-line PCBA 810-800082-043

The LAM Research 810-800082-043 is a VME Breakout PCBA (Printed Circuit Board Assembly).

Within the context of a KUKA robot integrated into a semiconductor fab, this board acts as a high-precision interface between the robot’s control system and the LAM tool’s VMEbus-based architecture.

Technical Specifications

This module is specifically engineered for Plasma Etching and Thin Film Deposition environments where electrical noise immunity and micro-second timing are critical.

Feature    Details

Manufacturer    LAM Research

Model/Part No.    810-800082-043

Type    VME Breakout Board / Industrial Control Module

Channels    16 Input and Output channels (typically)

Operating Voltage    220V (Standard Logic Power)

Certifications    CE, RoHS, UL

Dimensions    ~15 x 10 x 5 cm

Role in KUKA/LAM Integration

810-800082-043

In a wafer-handling cell, the 810-800082-043 serves as a signal distribution point. Here is how it interacts with the components you’ve previously mentioned:

Signal Routing: It “breaks out” complex signals from the main VME control rack into simpler wiring that can be read by the DSE-IBS card or the MFC inside the KUKA KRC2 cabinet.

Process Synchronization: It manages the handshaking signals (e.g., “Chamber Ready,” “Robot Clear,” “Vacuum Seal Engaged”) between the robot and the etch chamber.

Monitoring: It often handles high-speed sensor data (up to 30 kHz – 100 kHz) for monitoring plasma stability or wafer presence during the robot’s transfer cycle.

Troubleshooting the 810-800082-043

Failure of this breakout board will usually stop the entire automated process, even if the robot itself is healthy.

Communication Interruption: If the board fails, the KUKA controller may report an “External I/O Timeout” because it isn’t receiving the expected 24V signal from the LAM tool.

Visual Inspection: These boards are prone to “creepage” or chemical residue in fab environments. Check for any discoloration on the traces or pins.

Breakout Pins: Since this is a breakout board, the most common point of failure is at the physical terminal blocks or high-density connectors where the field wiring terminates.