GE

D20EME 0526-21170-1 Enhanced Master Communications Module for D20 Substation RTUs

GE D20EME 0526-21170-1 – Enhanced Master Communications Module for D20 Substation RTUs

The GE D20EME (part no.   0526-21170-1) is the enhanced master/communication engine used in GE’s D20 RTU platform.

From my experience, utilities and industrial plants typically deploy it to modernize legacy substations, bridge serial devices to Ethernet SCADA, and run multi‑protocol networks without rewriting their existing control schemes.

Key Features

Enhanced master CPU for D20 – Handles master polling, protocol translation, and data concentration for the D20 rack.

Ethernet + multi-serial connectivity – Typically provides 10Base‑T Ethernet and multiple RS‑232/RS‑485 ports for legacy IEDs and meters.

Utility‑grade protocol support – Common deployments use DNP3 (serial/TCP), Modbus (RTU/TCP), and IEC 60870‑5 (101/104) to integrate diverse vendor equipment.

Backplane powered – Draws power from the D20 rack supply, simplifying wiring and reducing cabinet clutter.

Drop‑in modernization – Keeps existing field wiring and serial devices while adding Ethernet SCADA access, which usually cuts migration time substantially.

Built for substation environments – In many cases rated for wide temperature ranges and electrical noise typical of primary switchgear rooms.

Brand / Model    GE D20EME (0526-21170-1)

HS Code    8537.10 – Boards, panels, consoles for electric control (≤1000 V)

Power Requirements    Backplane powered by D20 rack supply (typically 5 VDC via D20PS; low‑power module)

Operating Temperature    Utility‑grade; in most cases −40 to +70 °C for D20 family deployments

Communication Interfaces    10Base‑T Ethernet (RJ‑45) and multiple serial ports (RS‑232/RS‑485. port count varies by sub‑revision)

Signal I/O Types    Communications only (no discrete DI/DO on this module; pairs with D20 I/O cards)

Installation Method    Plug‑in card for GE D20 rack; front‑panel connectors for Ethernet/serial

Dimensions & Weight    Standard D20 single‑slot module; compact card‑level assembly (module mass typically under 0.6 kg)

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