Watlow

Watlow MLS316 Multi-loop thermal controller

Watlow Anafaze MLS316 is the central processing powerhouse of the legacy MLS300 series.

Designed as a high-density, multi-loop thermal controller, it is a staple in industrial environments requiring synchronized control of 16 independent loops from a single, modular base.

1. Introduction

The MLS316 16-Loop Processor Base Unit functions as the “CPU” of the MLS300 system.

It manages the PID algorithms, data processing, and communication for up to 16 loops of heat/cool control. Unlike standalone controllers, the MLS316 is part of a modular stack, typically requiring an Analog Input Module (AIM) for sensor feedback and a Control Interface Module (CIM) for communication.

It is renowned for its reliability in complex thermal processes like plastic extrusion and semiconductor fabrication.

2. Technical Parameter Table

MLS316

Feature Specification
Series MLS300 (Anafaze Legacy)
Control Loops 16 Loops (Heat, Cool, or Heat/Cool)
Input Voltage 10 to 28 VDC
Current Draw < 1 Amp (at MLS-PM)
Sampling Rate 10Hz (aggregate across loops)
Communication Modbus RTU via CIM module
Operating Temp 0°C to 50°C (32°F to 122°F)
Storage Temp -20°C to 70°C (-4°F to 158°F)
Dimensions 1.89″ x 3.78″ x 6.75″ (4.75cm x 10cm x 17cm)
Weight Approx. 1.75 lbs (0.8 kg)

3. Product Advantages and Features

Modular Scalability: Easily integrates with additional AIM modules to expand monitoring or control points without adding separate controllers.

Advanced PID Control: Features Anafaze’s proprietary algorithms for precise ramping, soaking, and auto-tuning.

High Loop Density: Manages 16 loops in a footprint significantly smaller than 16 individual 1/16 DIN controllers.

Centralized Communication: All 16 loops share a single communication port through the CIM, simplifying PLC/HMI integration.

4. Application Cases

Semiconductor Processing: Managing multi-zone wafer heating plates where thermal uniformity is critical.

Plastic Extrusion: Coordinating temperatures across the barrel, die, and adapter zones.

Packaging Machinery: Controlling multiple heat-sealing stations on a single production line.

Industrial Ovens: Managing complex ramp/soak profiles for composite curing.

5. Other Models in the Same Series

MLS332: 32-Loop Processor Base Unit for larger systems.

MLS300-AIM: Analog Input Module (required for sensor interface).

MLS300-CIM: Communication Interface Module (EIA-232/485).

MLS300-OIT: Operator Interface Terminal (Remote keypad/display).

MLS300-PS: Dedicated System Power Supply.

6. Installation and Maintenance

Installation

Mounting: Secure the base unit to a DIN rail or flat surface. Ensure the modules are “stacked” or connected via the appropriate ribbon cables.

Wiring: Use shielded twisted-pair cables for sensor inputs (connected to the AIM-TB boards). Ensure the MLS-PM receives clean 24VDC power.

Grounding: A single, solid chassis ground is essential to prevent signal noise from affecting PID stability.

Maintenance

Backup Battery: The MLS316 uses an internal battery for RAM retention. Check battery voltage every 2-3 years; if it drops below 2.5V, replace it to avoid losing “Job” recipes.

Cable Integrity: Periodically inspect the ribbon cables connecting the AIM and CIM modules for signs of heat degradation or loose connections.

Calibration: Verify loop accuracy annually using a certified process calibrator.

7. Unique Product Description

“The Watlow MLS316 is the ‘nerve center’ of industrial thermal intelligence.

By consolidating 16 loops of surgical PID precision into a single, modular processor, it transforms chaotic wiring into a streamlined,

high-performance control architecture. It is a legacy workhorse that remains the gold standard for high-density thermal reliability.”

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